SP360 BGA Rework Station
SP360 BGA rework station produces high-tem breeze, precisely controlling the soldering and desoldering process. With movable heating head, able to move horizontally; easy to operate. There is equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs.
SP360 Features:
- High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
- Movable heating head, able to move horizontally; easy to operate;
- Hot air below and above, can set temperatures independently; IR constant temperature heat
- 8 temperature settings above, can save for 10 settings. temperature settings below as above.
- Alarm and protection function for temperature-over.
- The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;
- The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
- Powerful cross flow can cool the lower heating area;
- The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;
- with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;
- Set with over temperature alarming and protection function;
- Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;
- The integrated design of machine and chassis is room-saving.
Suit for PCB | 50x50-430x350 mm |
Suit for chip | |
Max dimension | 55x55 mm |
Mini dimension | 7x7 mm |
Max weight | 80g |
Power for operation | 400w |
Main heater | 800w |
Lower heater | 800w |
Bottom heater | IR 2400w |
Power consumption | 4000w |
Dimension | 620x580x650 mm |
Weight | 33 kg |
Power for requirement | AC 220V, 50/60 Hz |