เครื่องยกชิพ BGA REWORK XDF-C


the specifications and technical parameters:
  1. The total   power   rate: 5200W
2. the upper part of heating power: 800 W  lower heating power: 800 W
3. the bottom of the constant heating power: 3.5KW                          
4. Power       source: 220V ± 10          50Hz ± 3
5. Dimensions:   800 × 500 × 580mm         
6. Temperature control: K -type thermocouple         
7. positioning: V -type slot PCB positioning
8. maximum fitness PCB size of 400 × 450mm
9. Weight: 35 ~ 40kg
Second, the special  points:
1. High precision imported raw materials (temperature controller, heater) precise control of BGA of the desoldering process.
2. the upper and lower independent heating temperature, which can set the 8- segment heating +8 section of constant temperature control, can also store 10 groups of temperature.
3. use high-precision thermocouples, to achieve an accurate temperature detection.
4. top heating and bottom heating with individual temperature curve go way high-power principle of cross-flow fan cooled quickly to ensure the PCB during the soldering process will not be deformed.
5. This machine has a computer communication function, built-in PC serial port, external temperature interface with software that enables computer-controlled.
6. desoldering and welding is completed with alarm function, in the case of the temperature control circuit to automatically power off.
7. For large thermal capacity of PCB and other high temperature requirements of lead-free soldering and so can easily handle.