เครื่องยกชิพ BGA REWORK XDF-D1


the specifications and technical parameters:
1. The total   power   rate: 5KW
2. Upper Heating power: 0.6kw
3. the bottom of the heating power: 0.6kw
4. Thermostatic heating power: 3KW
4. Power       source: 220V ± 10  50Hz ± 3
5. Dimensions: 800 × 500 × 580mm         
6 . Temperature control: K -type thermocouple      
7 . Positioning: V -type card slot, the opposite sex clip PCB positioning,
    8. maximum fitness PCB size of 470 × 400mm
9 . Weight: 35 ~ 40kg
Second, the special  points:
1. using human-computer intelligent fuzzy temperature control, precise control of BGA of the desoldering process.
2. can also set the 10- segment temperature +10 section of constant temperature control, can also store 50 groups of temperature.
3. selection of imported high-precision thermocouples, to achieve an accurate temperature detection.
4. by the upper and lower, constant temperature heating curves of three separate temperature zones, high-power principle of cross-flow fan cooled quickly to ensure the PCB during the soldering process will not be deformed.
5. The machine uses high-resolution man-machine interface, the details of the temperature heating curve clearer, easier to analyze the temperature parameters.
6. desoldering and welding is completed with alarm function, in the case of the temperature control circuit can automatically stop the heating output, with over-temperature protection.
  7. Welded part of the curve can be targeted alone hot air heating up and down, up and down according to the location of the chip height adjustment, random folder with the opposite sex, different shapes can be easily qualified welding board.
  8. The large thermal capacity of PCB and other high temperature requirements of lead-free soldering and so can easily handle.