เครื่องยกชิพ BGA REWORK XDF-A



the main specifications and technical parameters 3000W Number:
1. The total   power   rate: 3000W-3200W
2. Upper Heating power: 600W
3. the bottom of the heating power: 2400W
4. Power supply: Single phase 220V/230V   50/60Hz   3.2KVA
5. Overall dimensions: the body parts of 450 × 400 × 580mm
6 . Temperature control: high-precision K -type thermocouple
7 . Positioning: V shaped slot PCB positioning, the biggest meet PCB size of 280 × 320mm
8 . Weight: about 25kg
Second, the special  points:
1. using high-precision original accessories (temperature meters, relays, heaters) precise control of BGA of the desoldering process.
2. the upper and lower independent heating temperature, which can set the 8- segment heating +8 section of constant temperature control, can also store 10 groups or more temperature settings.
3. selection of imported high-precision thermocouples, to achieve the precise temperature detection.
4. by top heating and bottom heating temperature curve to go alone way to ensure that PCB in the welding process, not deformed.
5. equipped with manual vacuum suction pen for easy dismantling after welding sucked BGA .
6.PCB positioning with V shaped slot, flexible and convenient removable fixture on the PCB has protective effects.
7. For large thermal capacity of PCB and other high temperature requirements of lead-free soldering and so can easily handle
8. Heating complete with music prompts.